Energy Industry Meets for the RVP-AI/ROC&C
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Energy Industry Meets for the RVP-AI/ROC&C

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Perla Velasco By Perla Velasco | Journalist & Industry Analyst - Wed, 08/09/2023 - 13:42

This week, the International Summer Meeting on Power, Industrial Applications, and the International Fall Meeting on Communications, Electronic Computing, Automation, Robotics (RVP-AI/ROC&C) is taking place at the Palacio Mundo Imperial Riviera Diamante in Acapulco, Guerrero.

Organized by the Institute of Electrical and Electronics Engineers (IEEE) in Mexico, from August 6th to 10th, 2023, the RVP-AI/ROC&C focuses on crucial topics, such as the reliability and security of the national electrical system, electromobility, universal Internet access and cybersecurity.

Distinguished representatives from various institutions, such as CFE, the Mayan Train project, the National Institute of Anthropology and History (INAH), CANAME, CENACE, FONATUR, CIGRE and UNAM, among others, are participating in this event. CFE Director Manuel Bartlett Díaz, is also attending.

The event's program addresses crucial issues for the electrical sector, such as the electrical infrastructure of the Mayan Train, projections for the national electrical system and the relevance of energy storage. Influential figures from the industry share their perspectives in these key areas.

Activities aim to cover the most pertinent topics in the industry at the moment and project future trends in the Mexican energy landscape. In addition to technical sessions, the program includes social events to foster collaboration among attendees and interaction with members of the IEEE. Workshops have also been organized, taught by distinguished guests from entities such as CFE, CENACE, ABB, Huawei, among others.

The RVP-AI/ROC&C brings together experts from various fields to address critical issues in the energy and technology sectors. “The event provides a space for knowledge exchange, networking and discussion of future perspectives in an environment conducive to professional growth and collaboration," states IEEE.

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